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By S. Velumani and René Asomoza

ISBN-10: 0878493239

ISBN-13: 9780878493234

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SEM micrograph of (a) nanocomposite powder and (b) fracture surface of Ni/Al2O3 nanocomposites sintered at 1400˚C for 5 min using PECS. The sintered disc was cut into 3mm x 4 mm x 15mm rectangular specimen bars and the beam surface was polished to a mirror quality with diamond slurry. In order to investigate the crack disappearance function of the composites three indentations and derived cracks were introduced on the sample polished surface using a Vickers hardness indenter at a load of 49 N by 10 s.

Eng. Mater. Struct. 22 (1999) pp. 897– 903. S. R. Choi, V. Tikare. Crack healing behavior of hot-pressed silicon nitride due to oxidation. Scripta Metallurgica et Materialia, 26 (1992) pp. 1263–1268. C. Chu J. Korous, M. Nakatani, K. Ando. Crack healing behavior of silicon carbide ceramics. J. Am. Ceram. Soc. 83, (2000), 2788– 2792. [11]. K. Houjou, K. Ando, S. P. Liu, S. Sato. Crack-healing and oxidation behavior of silicon nitride ceramics. 2329–2338. [12] K. Ando, K. Furusawa, K. Takahashi, S.

Thus, the minimum crack disappearance time can be calculated as a function of temperature using eq. (2) and the activation energy (see fig. 8). These results indicate that crack disappearance of Ni/Al2O3 is more sensitive to temperature than SiC and less sensitive than mullite/SiC (413 kJ/mol) [11]. An evidence of crack disappearance process is given either by SEM or by XRD. Based on the above-mentioned discussions, the formation of the NiAl2O4 layer is predominately a mass transport process along the matrix grain boundaries, as Nanko et al.

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Advances in Semiconducting Materials by S. Velumani and René Asomoza

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